Presumably the column for 820-A is an older version of the Snapdragon 820 platform, but that is unclear. The benchmarks are from AnTuTu and show that Snapdragon 820 performance has improved considerably all around for the prototype devices. Furthermore, compared to the Snapdragon 810, the SD 820-B shows 1.38x and 1.77x performance improvements in single threaded integer and single threaded floating point tests.

Qualcomm is hard at work tweaking the Snapdragon 820 SoC before it becomes commercially available (allegedly, with Samsung lending a helping hand in testing), and as some of our readers might recall, earlier this month we also find out that a so-called “Snapdragon 820 V3.x” is rumored to be on its way for test sampling in October.

Samsung is continuing to test Qualcomm’s Snapdragon 820 inside the Samsung Galaxy S7, and things are looking quite good.

The Snapdragon 820 is being seen as a return to form for Qualcomm, using custom cores once again – rather than standard reference designs from ARM – and it would appear the company has tackled their thermal demons. The Galaxy S7 should be released some time next Spring, so talking about it too much right now seems a little premature, but as users will be upgrading from a Galaxy S5 from two-year contracts we wouldn’t be surprised if Samsung had something special up their sleeves.

At its current state, the SD 820 is said to score more than 75,000 points on AnTuTu benchmark but Samsung and Qualcomm are said to continue on their collaboration to further increase the power and capabilities that will be packed with the chip.

In addition to the Snapdragon 820 (and Exynos 8890), the Samsung Galaxy S7 is expected to feature 3GB of RAM, a 20-megapixel ISOCELL camera and may come in two size variants, a 5.2-inch model and a 5.8-inch model.

With rumors suggesting the Galaxy S7 may release as early as February, it might be logical for Samsung to outsource the chip for the 2016 flagship.